Customized smart devices and touchscreen devices and cleanspace manufacturing methods to make them

ABSTRACT

The present invention provides various aspects for processing multiple types of substrates within cleanspace fabricators or for processing multiple or single types of substrates in multiple types of cleanspace environments. In some embodiments, a collocated composite cleanspace fabricator may be capable of processing semiconductor devices into integrated circuits and then performing assembly operations to result in product in packaged form. Customized smart devices, smart phones and touchscreen devices may be fabricated in examples of a cleanspace fabricator. In some examples integrated circuits with unique encryption keys may be formed where the encryption keys are stored in physical aspects of the integrated circuit.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of the U.S. patent application Ser.No. 16/505,389 filed Jul. 8, 2019 which in turn is a continuation of theU.S. patent application Ser. No. 15/754,202 filed Feb. 21, 2018 which inturn was a National Stage Application of PCT Application No.PCT/US2017/49630, filed Aug. 31, 2017, which claims the benefit of U.S.provisional Application 62/383,218 filed Sep. 2, 2016. The contents ofthese heretofore mentioned applications are relied upon and herebyincorporated by reference.

FIELD OF THE INVENTION

The present invention relates to methods and apparatus that supportprototyping and manufacturing of customized smart devices based upon theenvironment created by cleanspace fabricators. More specifically, thepresent invention relates to methods of utilizing fabricator designswhich may be used to process high technology products and assemble theminto a packaged form with a focus on the utilization of additivemanufacturing techniques and 3D chip assembly techniques. Unique formsof smart devices and touchscreen devices which may be made with thesetechniques are also disclosed.

BACKGROUND OF THE INVENTION

A known approach to advanced technology fabrication of materials, suchas semiconductor substrates, is to assemble a manufacturing facility asa “cleanroom.” In such cleanrooms, processing tools are arranged toprovide aisle space for human operators or automation equipment.Exemplary cleanroom design is described in: “Cleanroom Design, SecondEdition,” edited by W. Whyte, published by John Wiley & Sons, 1999, ISBN0-471-94204-9, (herein after referred to as “the Whyte text”).

Cleanroom design has evolved over time from an initial starting point oflocating processing stations within clean hoods. Vertical unidirectionalairflow can be directed through a raised floor, with separate cores forthe tools and aisles. It is also known to have specializedmini-environments which surround only a processing tool for added spacecleanliness. Another known approach includes the “ballroom” approach,wherein tools, operators and automation all reside in the samecleanroom.

Evolutionary improvements have enabled higher yields and the productionof devices with smaller geometries. However, known cleanroom design hasdisadvantages and limitations.

For example, as the size of tools has increased and the dimensions ofcleanrooms have increased, the volume of cleanspace that is controlledhas concomitantly increased. As a result, the cost of building thecleanspace, and the cost of maintaining the cleanliness of suchcleanspace, has increased considerably. Not all processing steps, likefor example the steps used to assembly products into their packaging,need to occur in the developing large processing environments.

Additionally, the processing of high technology products may typicallybe split into portions that require high levels of cleanliness in themanufacturing environment which are typically at the beginning of theprocessing and then steps like the assembly steps which have lesscritical contamination sensitive processing. In some cases, these twotypes of processing steps may be processed in different facilitiesbecause of their different needs. Yet, in many small volume activities,the need for rapid processing of all steps to result in a product thatcan be utilized in its fully processed form may be important. It wouldtherefore be useful to have an efficient processing fabricator designthat can process the different types of steps of multiple cleanlinessrequirements in a single location with rapidity.

It would be desirable to advance procedures and equipment for theassembling of electronics based products in cleanspace facilities thatmay be used to fabricate mechanical enclosure, cases, and device bodiesfor smart devices and touchscreen devices. It would also be desirablethat the resulting devices may be customized for user preference andmanufactured and offered for sales in novel environments and locations.

SUMMARY OF THE INVENTION

Accordingly, building on the types of environments defined in previouspatents related to cleanspace environments, there are novel methods toutilize cleanspace fabricators for the purposes of both prototyping andmanufacturing and developing customized smart devices and touchscreendevices. Some of the processing steps may occur with substrates that arein a wafer form; while other steps may occur in substrates which are cutouts from that wafer form. Other substrates may relate to the processingof other types of components that may be married with semiconductorcomponents such as for example displays and energization elements.

Accordingly, the present invention provides description of how to definemethods and apparatus of utilizing cleanspace fabricator environmentscapable of processing high technology products from initial wafersubstrate form to final packaging into products that are completeprototypes and marketed goods. The utilization of additive manufacturingtechniques and three-dimensional chip packaging (hereafter referred toas 3DIC) techniques provide novel applications. Moreover, the productsthat may be fabricated in the unique environment may provide noveldevices in their own right. The ability to process in cleanspaceenvironments or a single cleanspace environment in one location maydramatically alter the form factor on components assembled into productgoods. For example, when ICs are placed directly from a testingenvironment into products without shipping, the ICs may be placed assingulated dice or pieces that are not covered in packaging. The workflows may save on packaging costs, testing costs and allow for muchquicker turn around cycles and more unique product definitions.

The techniques described herein may be useful in numerous methods. Amethod may be useful to create products which are combinations of one ofmore of integrated circuits, energization elements, display components,sensors, interconnection elements, fuel cells, batteries, discreteelectrical switches or connectors, and supporting cases or structure. Insome embodiments, a method may comprise introducing a semiconductorsubstrate into a cleanspace fabricator where the fabricator comprises atleast a first matrix of processing tools. There may be at least twotools comprising a tool body and a tool port each, where one of them isoriented vertically above or below the other at least in part. Theprocessing tools may have at least a portion of their body or portlocated or interfacing with a fabricator cleanspace. Said cleanspace maycomprise a first boundary and a second boundary where each of theprocessing tools is capable of independent operation and removable in adiscrete fashion relative to other processing tools. In someembodiments, the processing may also include processing on glasssubstrates. In some cases, the glass substrates may be in apredominately rectangular shape. In some embodiments, the glasssubstrate may be at least part of a touch screen display. The touchscreen display may be formed completely with processing that occurswithin the cleanspace fabricator or fabricators or in some cases somediscrete components such as switches, connectors, memory devices,batteries or fuel cell components may be added into the cleanspaceenvironment in produced form to be further processed into the product inthe cleanspace fabricator. Some of these components, such as for examplefuel cells may have some or all of their structure formed within acleanspace fabricator environment.

The glass substrate may be useful in some embodiments to define asubstrate upon which substantially all components are eventually added.The glass substrate may be one of numerous substrates that are processedin the cleanspace fabricator environment, where components are createdby processing on the non-glass substrates and then added upon the glasssubstrate.

In some embodiments, where all or substantially all of components withina product are created with cleanspace fabricators, the product may bedesigned and electronic models may be passed to the cleanspacefabricator. The resulting product may represent the realization of theelectrical design data in a physical form where semiconductor processingsteps transform electrical data into functioning circuits andinterconnect structures and additive manufacturing steps createstructure, encapsulation and surrounding material, which in some casesmay have a designed appearance in manners controllable within thefabricator environment. These methods may involve semiconductorsubstrates being processed in the type of cleanspace environmentspreviously mention, along with glass substrates in the similar or sameenvironment. Interconnect layers may be defined upon the glass substratewith processing steps within the cleanspace fabricator environment, orupon interconnect layers or features that are provided to the workingenvironment of the cleanspace fabricator such as flexible substrates.Electronic circuits fabricated in the cleanspace environment may beattached to the interconnect layers while within the cleanspaceenvironment, and additive manufacturing steps may be performed toencapsulate the various components and create structure of the resultingproduct. The result may be a prototype for a product or a marketableproduct as well.

In some examples, a product comprises two touch screens. The firsttouchscreen may be located antipodally to the second touchscreen so thatan essentially two-sided smart device is created. The smart device maybe a smart phone. The smart phone may have a separate cellular and WIFIphone capability. Each of the cellular and WIFI phone capability mayinterface with a different touchscreen display. In some examples, thephone may comprise a cellular capability and a DECT phone capability. Insome examples, the smart phone comprises two cellular communicationaccounts, wherein the first cellular communication account is displayedon the first touchscreen while the second cellular communication accountis displayed on the second touchscreen.

In some other examples, the smart device with two touchscreens mayinclude examples wherein the second touchscreen interfaces with afunction that physically connects and disconnects one or more of thesmart device antenna, the smart device cameras and the smart devicemicrophones. In some examples, the smart device may comprise a secondtouchscreen which interfaces with an encryption capability thatinterfaces with the electronics and storage elements that interface withthe first touchscreen. The encryption capability may encrypt data as itis received through cellular transceivers of the smart device. In someother examples, the encryption capability encrypts data stored in flashmemory of the device.

In some examples, a two-sided smart phone device may comprise theability to display the rear facing camera of a standard smart phone onthe second touchscreen display.

There may be methods that produce a customized smart device. In someexamples the method may include the steps of obtaining a cleanspacefabrication system; installing the cleanspace fabrication system in amulti-floor storefront; soliciting desired customization options from auser; producing a case capable of holding first and second touchscreendevice; installing electronics to interface and drive the firsttouchscreen; installing electronics to interface and drive the secondtouchscreen; installing a baseband integrated circuit within the smartdevice; and installing the first and second touchscreen in the case,wherein the first touchscreen is on a first large surface and the secondtouchscreen is on a second large surface and wherein the first largesurface is antipodal to the second large surface. One general aspectincludes an encryption protocol protected communications systemincluding: a first smart device including: a first display screen,including a touchscreen; a first wireless communication circuit, wherethe first wireless communication circuit communicates digital data intoand out of the first smart device; a first memory circuit of the firstsmart device; a first processor, where the first processor performsprocessing steps of application software of the first smart devicestored within the first memory circuit, where the processing steps ofapplication software display at least a first display message on thefirst display screen; a first hardware encryption device including: asecond memory circuit, including a data storage function with a writecapability, where data values stored within the second memory circuitare written during an assembly process of the hardware encryption deviceinto the first smart device as a series of encryption codes; a secondprocessor, where the processor receives an input data value at a databus connected to the processor, and where the processor performs anencryption algorithm utilizing data values of the second memory circuit;and a first physically measurable device, where the first physicallymeasurable device is contained within encapsulating layers of the firsthardware encryption device, and where at least a first measurement ofthe physically measurable device is utilized in generating the encrypteddata value.

One general aspect includes a method of forming a smart device withhardware based encryption including: forming a main circuit board of thesmart device including a memory circuit, a processing unit, and acommunication circuit; adding to the main circuit board a hardwareencryption integrated circuit, where the hardware encryption integratedcircuit has at least a first connection pad and a second connection padon its external packaging to connect to circuit traces of a physicallymeasurable device; depositing a first conductive film, where the firstconductive film is a portion of a stack of encapsulating films whichencapsulate at least the hardware encryption integrated circuit; imaginga pattern of interconnect pathways and connection pads into the firstconductive film using photolithography and a photoresist system; etchingthe pattern of interconnect pathways and connection pads into the firstconductive film based on the imaged pattern; removing residualphotoresist; placing a film upon the connection pads, where the film hasa characteristic that can be measured electrically at the connectionpads, and where the characteristic may be modulated by selectiveprocessing of the film; modulating a physical characteristic of the filmwith a laser irradiation process; and depositing a second conductivefilm upon the film, where a connection pad outside the film electricallyconnects the second conductive film to the second electrical connectionpad of the hardware encryption integrated circuit. Other embodiments ofthis aspect include corresponding computer systems, apparatus, andcomputer programs recorded on one or more computer storage devices, eachconfigured to perform the actions of the methods.

Implementations may include the method where a resistance of at least afirst portion of the network of connection pads is known to be accurateto two degrees of precision, and where a resistance value truncated tothe two degrees of precision is used as a portion of an encryption codeof the hardware encryption integrated circuit. The smart device where asecond paired hardware encryption device is located at atelecommunications provider.

One general aspect includes a method of protecting a data communicationof a smart device. The method also includes assembling a uniqueintegrated circuit into a smart device, the unique integrated circuitmay include: at least a portion of a unique encryption key is physicallyencoded into hardware of the unique integrated circuit during assemblyof the unique integrated circuit, and a processor of the uniqueintegrated circuit operational to perform encryption processing upondata communicated into and out of the smart device routed through theunique integrated circuit. The method also includes configuring thesmart device to pass communications through the unique integratedcircuit to be encrypted before transmission of the data.

Implementations may include one or more of the following features. Themethod additionally may include: producing multiple copies of smartdevices may include unique integrated circuits where at least a portionof the physically encoded encryption keys of the multiple copies arematched to allow end to end encryption through the unique integratedcircuits.

One general aspect includes a method of producing a customized smartdevice including: obtaining a cleanspace fabrication system; installingthe cleanspace fabrication system in a multi-floor storefront;soliciting desired customization options from a user; producing a casecapable of holding a first touchscreen device; installing electronics tointerface and drive the first touchscreen; installing a basebandintegrated circuit within the smart device; installing a hardwareencryption device within the smart device; writing customized encryptioncodes into a memory circuit of the hardware encryption device; andencapsulating the hardware device with a multilayer encapsulation stack,where a plurality of physically measurable devices are included in theencapsulation stack and electrically connected to the hardwareencryption device, where removing the encapsulation stack to gain accessto the hardware encryption device would alter at least a first physicalmeasurement from the physically measurable devices, and where the firstphysical measurement is used by the hardware encryption device indetermining an instant encryption code.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, that are incorporated in and constitute apart of this specification, illustrate several embodiments of theinvention and, together with the description, serve to explain theprinciples of the invention:

FIG. 1 illustrates some exemplary cleanspace fabricators

FIG. 2 illustrates an exemplary set of collocated cleanspace fabricatorsfor different types of processing in a single location.

FIG. 3 illustrates an exemplary embodiment where two differentcleanspace environments are created in a single cleanspace fabricatordesign with an intermediate wall.

FIG. 4 illustrates exemplary general shapes of cleanspace fabricatorswith their cleanspaces for annular tubular examples, sections of annualtubular and combinations of various cleanspace fabricators withdifferent cleanspace environments.

FIG. 5 illustrates an exemplary cleanspace fabricator for processingmultiple types of substrates where a single cleanspace environment isutilized with multiple and varied types of automation.

FIG. 6 illustrates examples depicting different types of substratecarriers that might be processed in different processing tools includinga single wafer carrier, a multiple wafer carrier and an exemplary wafflepack carrier.

FIG. 7 illustrates processing of different substrate types in cleanspaceenvironments resulting in a product combining devices from the differentsubstrate types.

FIG. 8 illustrates examples of processing that occurs inthree-dimensional Integrated Circuit or three-dimensional packagingtechnology.

FIG. 9 illustrates examples of additive processing techniques that maybe carried out in cleanspace fabrication environments.

FIG. 10A-10F illustrate an exemplary two-sided smart phone device.

FIGS. 11A and 11B illustrate exemplary customized functions of atwo-sided smart phone device.

FIGS. 11C and 11D illustrate additional exemplary customized functionsof a two-sided smart phone device.

FIG. 12 illustrates an enhanced “selfie” capability enabled by atwo-sided smart phone device.

FIGS. 13A and 13B illustrate a DECT or WIFI phone capability of a secondside of a two-sided smart phone device.

FIGS. 14 A and 14B illustrate multiple cell service in the sametwo-sided smart phone device.

FIGS. 15 A and 15B illustrate mirroring a first screen of a two-sidedsmart phone device on the second screen.

FIGS. 16 A and 16B illustrates customization with selectable capabilityenhancements to a standard two-sided smart phone device such as sensors,touchlets and functional enhancements.

FIG. 17 illustrates novel fabrication locations and fabricationfacilities to create customized smart devices and touchscreen devices.

FIG. 18 illustrates an encryption scheme between paired or combinationof devices.

FIG. 19 illustrates method steps for forming a hardware encryptiondevice with physically measurable aspects.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

The present invention relates to methods and apparatus to createcustomized smart phone, smart device and touchscreen devices. In someexamples, a collection of processing tools is assembled into acleanspace fabricator with the capability of shaping structural casesand assembly supports, as well as capability to place and electricallyconnect various types and forms of devices such as touch screens,batteries, integrated circuits, circuit boards, flex boards and cables,switches, sensors, i/o connectors and the like. In some exemplaryembodiments of this type of processing, substrates in the form of wafersmay be processed either fully or at latter customization steps to createintegrated circuits upon the substrate and then in subsequent processingthe integrated circuits can be processed to result in a discreteintegrated circuit that may be placed into the custom cases andassemblies fabricated in the fabrication environment. The fabricationenvironment may be a small cleanspace enabled facility that may fit intostorefronts and locations of the type.

Cleanspace fabricators may come in numerous different types. Proceedingto FIG. 1, a number of exemplary cleanspace fabricators are depicted. Initem 110, a fabricator is depicted which is made up of numerousessentially planar cleanspace fabricators elements which are connectedtogether. In item 120, a single standalone planar cleanspace isdepicted. Item 130, depicts a round tubular annular cleanspacefabricator type. And, item 140 depicts a square exemplary tubularannular cleanspace fabricator type. It may be apparent that manydifferent variations on these fundamental types of fabricators areincluded in the general art of cleanspace fabricators. In these versionsof fabricators, a common mode of operations would be for the fabricatorsto process wafer form substrates of one type from when the substratesenter the fabricator to when they leave it. A different embodiment typeof these fabricators may derive if there are multiple types ofsubstrates that are simultaneously being processed in the fabricator.

Fabricators with Semiconductor Wafer Processing Cleanspace Elements andSemiconductor Die Packaging Cleanspace Elements.

Significant generality has been used in describing cleanspacefabricators because there are numerous types of technology fabricationthat are consistent with the art including in an exemplary sense theprocessing of semiconductor substrates, Microelectromechanical systems,“Lab on Chip” processing, Biochip processing, and many other examplesincluding the processing of substrates which support device productionor are incorporated into devices as they are produced. Without losingthe generality and purely for exemplary purposes, some examples thatrelate to the processing of semiconductor substrates will be used toillustrate the inventive art being described.

Proceeding to FIG. 2, item 200 two essentially planar cleanspacefabricator elements are depicted. Item 210 depicts a first cleanspaceelement, which in an exemplary sense, may show a cleanspace fabricatorwhere the substrate type is semiconductor wafers and the equipment ortools used to process semiconductor wafers into integrated circuits onwafers may be depicted for example as item 245. Item 210 is a cleanspacefabricator, and one embodiment type of such a fabricator may have thefollowing distinguishing characteristics. The fabricator has acleanspace, item 270, which is bounded by walls which span numeroustooling levels. In some embodiments, items 250, 255, 260 and 265 maydefine walls surrounding the cleanspace 270. Within cleanspace 270, maybe located the ports of various processing tools, for example, one ofwhich is depicted as item 240. For that processing tool, on the otherside of the cleanspace boundary, item 250, the body of the processingtool may be represented as item 245. In some embodiments, airflow tocreate the clean environment of the cleanspace may proceed in aunidirectional manner from and through wall 250 to and through wall 255.In other embodiments, the direction of the flow may be reversed. Instill other embodiments the flow may proceed from wall 250 to wall 255but do so in a non-unidirectional manner. In some embodiments, walls 260and 265 may simply be smooth faced walls which do not relate to the flowof air around them, alternatively the walls may either correspond to airsource walls or to air receiving walls. As well, the nature of the airsource walls may be defined by placing HEPA filters upon the wall andeither flowing air through the wall and then through the HEPA Filters oralternatively flowing air to the HEPA filters and then flowing the airout of the filter surface into the cleanspace. There may be otherembodiments of the cleanspace type where the airflow in unidirectionalfashion or in non-unidirectional fashion may be flowed from the top ofthe cleanspace to the bottom. There may be numerous manners of definingthe airflow within a cleanspace consistent with the art of cleanspacefabrication.

Within the cleanspace, item 270, there may be located automation whichis capable of processing wafer carriers which contain the substrates tobe processed. In an exemplary fashion, in embodiments where cleanspacefabricator element 210 is formed to process semiconductor wafers tocreate integrated circuits, the cleanliness requirements of thecleanspace fabricator may be significantly demanding. As shown in FIG.2, the processing tools may be arranged in a vertical and horizontalmanner which in some embodiments may be termed a matrix; that is wheretools are generally located at discrete vertical heights or levels andthen at various horizontal locations between two standard verticallimits. As the substrates are processed and various electrical elementssuch as in a non-limiting sense, transistors, resistors, and capacitorsare formed and then electrically interconnected with conductive lines,at some point the device structure with its interconnections may becompleted. The resulting wafer is an embodiment of one type of productof such operations in a cleanspace fabricator as are the individualresults of each processing step. Yet the fully formed product may nowhave completed the time it needs to spend in the highly cleanenvironment of cleanspace fabricator element 210. A wafer in such acompleted form may then be ready to be further processed in manners thatmay require cleanspace processing but at a significantly less severecleanliness requirement. As may be apparent, cleanspace fabricatorsprovide an innovative manner to continue such processing. In someembodiments, a similar essentially planar cleanspace fabricator, item220 may be located in the general vicinity of fabricator 210. Thecleanspace, 280, of this fabricator 220 may as mentioned be operated ata lower cleanliness requirement when compared to cleanspace 270.

Processing on the substrate, in the wafer form mentioned, may continuein this second cleanspace fabricator element, 220, through a variety ofprocessing steps in a variety of testing and assembly type tools,depicted in an exemplary sense as item 225. The types of testing thatmay be performed include testing of transistor parameters on testdevices, testing of the parametrics of other test devices that modeldevices or yield related structures, testing of test devices thatrepresent circuit elements within larger devices and testing of fullyformed integrated circuits for various aspects of their functionality.In addition, testing on a wafer level may be performed on structuresthat test for the reliability aspects of the processing that hasoccurred. Other types of testing may involve characterizing physicalaspects of the processing that has occurred on the substrate like forexample physical thicknesses and roughness for example. Still otherembodiments of testing may characterize defectivity aspects of the waferprocessing as for example incorporated particulates, missing or extrafeatures on the processed device or other measures of defectiveness.There may be numerous forms of testing that may occur on the substratewhich has been processed in a first type of cleanspace environment.

Other processing which may occur in fabricator environment 220 mayinclude steps which take the wafer form of substrate and createdifferent forms of a second substrate type which may be furtherprocessed in fabricator 220. An example of such a second form mayinclude “Dice”, “Die” or “Chips”. These items may commonly berectilinear pieces that are cut out of the wafer form substrate. Some ofthe exemplary processing steps that may be performed in tools of thetype that would be placed in fabricator 220 may include thinning of awafer or die, cutting processes to create the die from the wafer form.Other examples may include polishing steps that can be performed afterwafer thinning is performed. The wafers may also have various films andmetals deposited on the top or bottom side of the wafer substrate forvarious purposes.

Other classes of wafer processing that can occur in an “assembly”portion of a multiple substrate cleanspace fabricator may relate to thegeneral processing steps classified as “Wafer Level Packaging” steps. Inthese steps the thinning, coating and other processing steps to createinterconnects and encapsulated package elements are all performed on awafer level format.

Some of these steps, in other embodiments may relate to chip levelpackaging. For example, substrates in die form may be attached, glued,affixed or bonded to various forms of metal or insulator packaging. Thepackages that the dies are mounted to may typically have electricalleads that come out of them in between insulating and hermeticallysealing regions. The connection of metal lines from the integratedcircuits to the package leads can occur with numerous processingincluding for example, wire bonding and flip chip or solder bumpprocessing . . . in some processing conductive adhesives, epoxies orpastes may be applied. Thermal processing and annealing may be performedon the wafers, dies or packaged die forms. There may be many other typesof processing standard in the art of packaging that would comprisedifferent types of tooling in the exemplary fabricator 220.

More complex processing of the die may occur relating to various 3dpackaging schemes where the end product may have in some embodimentsmultiple levels of die stacked upon each other. Some of the exemplaryprocess types that drive various types of tooling for the processinginclude thru silicon via processing, die stacking, interposer connectionand the like. As mentioned, regardless of the sophistication of thevarious packaging schemes, processing of substrates of a die form mayoccur in a cleanspace fabricator environment.

Proceeding to FIG. 3, item 300, a representation of a different way toconfigure a cleanspace fabricator to process different types ofsubstrates is shown. In a similar fashion of item 200, there are twodifferent fabricator elements for different cleanspace types. Item 310may represent a cleanspace, in an exemplary sense, that is of highcleanliness specification, consistent with processing of integratedcircuits into semiconductor substrates. Additionally, item 320 mayrepresent the lower cleanliness specification cleanspace environmentconsistent with “assembly” processing. The two cleanliness environmentsmay be formed in this embodiment type by the insertion of a physicalseparation, shown as item 330, with an essentially planar fabricatortype. Item 330 may be as simple as a wall, or as shown may be two wallson each fabricator element side with various equipment running inbetween. As mentioned before there may be numerous means to establishthe cleanliness of the cleanspace environment through various types anddirections of airflow consistent with the art herein.

Exemplary Types of Cleanspace Combinations to Form Collocated CompositeCleanspace Fabricators.

In FIG. 4, there are various embodiments of cleanspace fabricators andsome exemplary derivations of those types that form fabricators withmultiple cleanspace environments associated with processing substratesto different requirements of cleanliness of environment where themultiple environments are at a collocated site. Item 410 and 420 depictsimple annular, tubular cleanspace fabricators. Item 410 is a roundannular tubular cleanspace fabricator and item 411 may represent atypical location of a primary cleanspace in such a fabricator. Item 420may represent a rectilinear annular tubular cleanspace fabricator withits exemplary primary cleanspace represented as item 421.

From the two basic cleanspace fabricator types, 410 and 420 a number ofadditional fab types may be formed by sectional cuts of the basic types.A sectional cut may result in a hemi-circular shaped fabricator, 430with its exemplary primary cleanspace as item 431. A section cut of item420 may result in an essentially planar cleanspace fabricator, similarto that discussed in previous figures, where the primary cleanspace isrepresented by item 441. And in another non-limiting example, acleanspace fabricator of the type 450 may result from a sectional cut oftype 420 where it too may have a primary cleanspace indicated by item451.

When these various fabricator types are combined with copies ofthemselves or other types of cleanspace fabricators, a new type ofcleanspace fabricator may result which is a composite of multiplecleanspace environments. A few of numerous combinations are depicted.For example, item 460 may represent a combination of a first fabricatorof type 430 with a second fabricator of type 460. Item 461 may representa first cleanspace environment in this composite fab, 460 and item 462may represent a second type of cleanspace environment. Alternatively,item 470 may be formed by the combination of two versions of fabricatortype 440, where the two, different primary cleanspace environments areshown as items 471 and 472. This fabricator shares similarity to thetype of fabricator depicted in item 300. Another exemplary result mayderive from the combination of two fabricators of the type 440 as shownin item 480. Item 480 may have two different primary cleanspace regions,items 481 and 482. And, in some embodiments, item 483 may represent athird cleanspace region. It may be apparent that the generality ofcombining two different cleanspace elements to form a compositefabricator may be extended to cover fabs made from combinations of 3 ormore fabricator cleanspace elements.

Multiple Automation Systems in Cleanspace Environments for theProcessing of Multiple Substrate Types.

An alternative type of cleanspace environment for processing of multipletypes of substrates may be represented by item 500 in FIG. 5. In afabricator of this type, 510, there may be only one cleanspaceenvironment represented as item 570. In some embodiments, thiscleanspace may be defined by a unidirectional airflow flowed from orthrough wall 555 to wall 560 where walls 545 and 565 are flat walls. Insome embodiments, there may be a tool port, 550 which residessignificantly in the cleanspace, 570, which may be called a fabricatorcleanspace in some embodiments, while a tool body, 540 resides outsidethis first cleanspace 570.

In some embodiments, the cleanliness of the cleanspace environment, 570,may be uniformly at the highest specification required for any of theprocessing in the fabricator environment. In such embodiments,therefore, the environment may exceed the needs of other processingsteps that are performed within it. Since there may be multiple types ofsubstrates processed in the environment, as for example wafers and dieform, there may need to be two different types of automation present tomove substrates from tool port to tool port. For example, item 520 mayrepresent a robot that is capable of moving wafer carriers through theuse of a robotic arm 521. And, item 530 may represent a piece ofautomation that is capable of moving die carriers through use of adifferent robotic arm 531, from tool port to tool port. In fabricatorsof this type, in some embodiments there may be tools that have twodifferent types of tool port on them, one consistent with handling afirst type of substrate like for example wafer carriers and anothercapable of handling die carriers.

In some embodiments, in a non-limiting sense, such a tool might includea tool for dicing wafer into die. In this case, carriers with waferswould be input into the tool through one port shown for example as item550 and then die carriers may leave the tool through tool port 551.

Other manners of processing multiple substrates may include for exampletools which take substrate carriers from a region external to thecleanspace fabricator like item 580 and place them into the cleanspaceenvironment through a tool port. In a similar fashion, substrates invarious types of carriers may also exit the fabricator environmentthrough a processing tool to an external environment like 580 as well.Alternatively, there may be other means to directly introduce or removesubstrate carriers into the cleanspace environment directly through acleanspace wall, for example through wall 545.

In any of the cleanspace fabricator embodiments where multiple types ofsubstrates are processed within a single type of cleanspace environmentthere may be need for multiple types of automation. This may be true forthe type of single fabricator environment shown in item 500 oralternatively for the composite types shown previously where multiplesubstrate types are processed. It may be clear, that another embodimentmay derive where the automation devices, like item 520, are capable ofhandling multiple substrate carrier types.

Types of Carriers that May be Processed within Composite CleanspaceFabricators

Proceeding to FIG. 6, there are a number of substrate carriers that aredepicted for example. In item 610, there is depicted an exemplarysubstrate carrier where one, 611, substrate piece is included. In someembodiments, the substrate piece may include a semiconductor wafer wherethe wafer has a dimension of roughly 2 inches. In other embodiments, thesubstrate piece may include a semiconductor wafer where the wafer has adimension of 8, 12 or 18 inches. In still further embodiments, thesubstrate piece may be a round, square or sheet which includessemiconductor, metallic and/or insulating material

Other types of carriers may have the capability of containing numeroussubstrate pieces. For example, item 620 may represent a multiplesubstrate carrier where items 621 are the multiple substrates. There maybe numerous types of substrates which include but are not limited to thetypes discussed in the previous discussion of a single substratecarrier. Some examples of such a carrier might include SMIF pods andFOUPS in the semiconductor industry.

As mentioned in the previous discussions, some substrate types may bedefined from pieces of a larger substrate which has been cut intosmaller segments. These pieces may be carried around in various types ofcarriers. An example may be a “waffle pack” 630 where the carrier hasmultiple wells or chambers 631 into which the segmented substrates maybe placed and then carried for further processing.

It may be apparent that a cleanspace fabricator may be capable ofprocessing numerous types of substrates where the substrate processingneeds to occur in a clean environment. Although examples of certainsubstrates have been included, the spirit of the invention is intendedto embrace the inclusion of all the different types of substrates thatmay be processed in a cleanspace fabricator.

Touch Screen Displays as Substrates

In an example of how the cleanspace fabricator environments that havebeen discussed may be utilized, consider a substrate running in acleanspace fabricator to be a 4.75 inch by 2.5-inch piece of touchscreenglass. In some embodiments, the example substrate may already have themultiple layers comprising the touch screen elements and the displayscreen elements upon it. In other embodiments, the layers of conductiveelectrodes, adhesive and spacer layers, surface treatments for displaycleanliness etc. may all be process towards the end of the productionprocess.

In an example, the Touch Screen may have its capacitive, resistive,piezoelectric or other detection schemes films already placed upon theglass. As well the LCD or OLED or other display screen components mayalso be already deployed upon the substrate. Protective films may beapplied to the front side of the Touch Screen so that it may be handledby automation equipment in the cleanspace fabricator. The variouselements and films may limit the temperature, electrical charge,magnetic field environments that the substrate may be subjected to infurther processing. Nevertheless, the exemplary touchscreen piece maycomprise an acceptable substrate for a cleanspace fabricator.

The touchscreen and display components may have electrical connectionsthat are formed upon the back of the Touchscreen substrate. In someembodiments, layers of flexible connector or flexible substratematerials may be connected and stacked upon the back of the substrate,forming routing lines for signals and power. These processing steps mayoccur in a cleanspace fabrication environment. Although the sensitivityto particulate components may be less for these applications than formaking integrated components, particulate control will nevertheless benecessary as may be achieved in the cleanspace environment.

In an alternative to flexible connector substrates, in other embodimentsmetallic films may be deposited and imaged to create conductor patterns.Lithography together with etching techniques, such as reactive ionetching or wet chemical etching may be used to etch the metallicinsulator layer. By combining the processing of imaged metal layers anddielectric layers with via holes, a multilayer routing scheme may beprocessed onto the back of the Touchscreen Substrate. These routinglines or conductive traces may interconnect the Touchscreen componentsto each other or to electrical circuitry. As well, the interconnecttraces may connect electrical components to each other regardless ofwhether for those particular traces, a touch screen component isconnected. The substrate can support the interconnection of variouscomponents.

Touch Screen Products Fabricated in Cleanspace Fabricators

Proceeding to FIG. 7, the touch screen processing described in theprevious section as well as a more general discussion of fabricatingtouchscreen based products in cleanspace fabricators may be found. At710, a Touchscreen type substrate is depicted. It may have touchscreenelements, display elements and input/output elements like switchesalready configured upon it or these may be attached at a later time.

At 711, the processing to make a multilayer routing scheme of imagedmetallic traces separated by insulator levels with via interconnects mayoccur. In some other embodiments, multiple layers of flexibleinterconnect layers may be adhered and interconnected at 711. The resultat 712 may be a Touchscreen substrate that has interconnection tracesupon it. The topmost later of interconnects may have terminal via pointswere additional components may be connected.

Before connecting additional components at 713 a layer of encapsulatingmaterial may be applied to the substrate. The encapsulating material maybe comprised of various polymeric materials and adhesive materials likeepoxies for example that have both insulating properties and chemicalencapsulating properties. In some embodiments, the materials may beapplied by spray processes or rolled applicators or other bulkapplication processes which may be followed by steps to create via holesin the layer for interconnection of other devices. In other embodiments,the materials may be directly printed upon the substrate. Withthree-dimensional printing techniques or more generally with additivemanufacturing technologies, the encapsulating layer may be built uponthe substrate during step 713 and have missing printed features forvias. In other embodiments both encapsulating features and conductivevias may be added to the layer by additive manufacturing processing. Inan example, an insulating epoxy and a conductive epoxy may be used tocreate a layer that has predominantly insulating regions as well asconductive vias. Other additive manufacturing processes may createmetallic features at the via locations as for example with a power basedlaser sintering process.

The conductive films of conductive epoxies or of sintered powder baseddeposits may comprise Titanium, Gold, Silver, and Copper for example.And the starting material for the powders or within the epoxies maycomprise microscopic and nanoscopic powders made from Titanium, Gold,Silver and Copper as examples.

The resulting encapsulated Touchscreen substrate with multilayerinterconnect schemes may be found at 714. In some embodiments, externalcomponents for external connections and input/output functions may beadded to the substrate as shown in exemplary form as the solid blackfeatures at 714. These features may represent power interconnections,signal interconnections, switches of various kinds and the like.

Another type of substrate to run in the same cleanspace fabricator or inan attached or associated cleanspace fabricator may be a semiconductorsubstrate as shown at 720. Through numerous processing steps, integratedcircuit components may be manufactured upon the semiconductor substratein manners related to those discussed in other inventive art associatedwith cleanspace fabricators. The resulting product wafer at 720 maysubsequently be processed at 721 to thin the substrate material and insome embodiments to singulate the integrated circuits creating “Die” or“Dice” as shown at 722. These dice may be added to the Touchscreensubstrate during the process at 723. The processes at 723 may includeflip-chip solder ball related attachment as an example but the generalart of connecting integrated circuit die to packaging may be consistent.In the case of the depicting at 724; however, the die may be attached ina non-packaged form directly to the touchscreen substrate as item 725for example. The die may be tested at various points both before beingattached to the Touchscreen substrate and after being attached.

In a subsequent section, three-dimensional assembly andthree-dimensional IC manufacturing techniques will be discussed. Theresult of these processing steps may likewise be attached at step 724 inthe location identified as items 726. In some embodiments, thethree-dimensional assembly processing may occur stepwise and use theTouchscreen substrate to support the die as they are processed andultimately attached to the substrate.

At 730, a third type of substrate may be processed through thecleanspace fabricator environments. A critical component in electronicproducts is the energization elements that power the function of theproducts. In some embodiments, these elements may be batteries which maytypically be rechargeable type batteries. The basic structure ofbatteries of various types may include a cathode electrode along with acathode chemical moiety electrically connected to the cathode electrode.The cathode, both electrode and chemistry, may be then contacted to aseparator region along with an electrolyte in the separator region. Theseparator region may allow the electrolyte or ionic portions of theelectrolyte to transfer across it. On the other side of the separatorregion may be the anode region which may comprise both an anode chemicalmoiety and an electrically connected conductive anode electrode. Theconstruction of structures of this type may be performed in a cleanspacefabrication environment. At 731, the two conductive electrode plates maybe processed to form a cathode/separator electrolyte/anode structure.Rechargeable solid-state batteries as well as chemical form batteriesmay be constructed. In some embodiments large plate batteries, sometimeof more than two electrode levels may be formed at 732. In otherembodiments, that may preferably be constructed in cleanspaceenvironments, the battery plates with 732 may be formed of numerousindividual battery regions which form many different battery cells. Thetechniques and requirements to form such batteries may be favored by theprocessing environment of a cleanspace fabricator.

There may be numerous reasons to assemble the battery units withmultiple cells. The individual cells may be connected in variousparallel and serial fashions for different purposes, and they may beattached to integrated circuits which control the use of the individualbattery cells. The integrated circuits may control the charging anddischarging of the multiple cells as well as sense their functionalityfor defective and non-functioning cells.

Batteries have significant energy storage capabilities. However, fuelcells offer the potential of multiplying the energy storagecapabilities. Fuel cells function by extracting the chemical energy ofchemical feedstock. Various chemical species have been used in standardfuel cell technology. Gasses such as hydrogen have been used, butliquids may also be used. Methanol and Ethanol may have the capabilityultimately of a ten to twenty-fold increase in energy density.

A fuel cell is made of multiple layers that are similar to a batteryconstruction. Conductive anode and cathode contacting layers are used tocollect the charge carrying species. However, the chemical feed stockmust be able to move from external to the fuel cell to anode layers thatalso include catalysts for the dissociation of the chemical species. Apermeable membrane may separate the anode catalyst from the cathodecatalyst layer. A permeable layer to oxygen flow may separate thecatalyst from the cathode conductive layer. The above discussions maydescribe in general terms the types of layers that may be comprised inbatteries and fuel cells to illustrate the applicability of thecleanspace fabrication environment to the construction of devices ofthese types.

In some embodiments batteries may be fabricated, in other embodimentsfuel cells may be fabricated. In other embodiments regions of batteriesand regions of fuel cells may be fabricated. These elements may bedirectly fabricated upon each other or at 734 they may be fabricateddirectly up the assembled devices on the Touch screen substrate. At 733,in embodiments where the fuel cells and/or batteries are made separatelyfrom the touchscreen substrate they may be added and connected to theTouch screen substrate. The electrical connection and bonding of thedevices again may benefit from a clean environment for defectmitigation. The connected battery and fuel cell components may also becoated and encapsulated by various techniques at 734. A cleanspacefabricator environment may assemble complicated technology processingtools of various kinds in single locations. Particularly when the toolsare smaller in size, this may allow for the ability of constructing morecomplicated battery and fuel cell structures in processes that aresimilar to that utilized in semiconductor and MEMS processing.

In some embodiments, the described components may define an entirefunctional touchscreen device such as a mobile phone or a tablet or laptop computer. At step 735 the resulting product may next be encapsulatedand finished in various manners to form the device at 740. In someadditive manufacturing steps, a plastic body layer may be formed. Inother steps, a metal case may be formed by additive manufacturing.Alternatively, a fabricated metal cover may be adhesively attached tothe touch screen substrate device. By incorporating many components intosmall devices, the potential exists for the heat created by thecomponents to cause thermal issues. Additive manufacturing may alsoprovide for the ability to embed thermally conductive structures thatspread and dissipate thermal load from hot spots through the entiredevice.

There may be abundant variation in the processing of products like thatdescribed at 740. In the exemplary description, the use of directencapsulation may offer enhanced structural strength and chemicalresistance. In addition to higher strength design potential or lowermaterial weight of the structure, these factors may allow for novelembodiments to fill fuel cell power sources and may even includeimmersion of portions of the device in the chemical feedstock since theencapsulation may protect components from exposure.

A cleanspace fabrication entity that can tie together so many elementsof construction of complicated electronic devices may provide numerousand significant advantages for a development process. Many aspects ofthe design process may flexibly be changed with the cleanspacefabricator based infrastructure, such as improved times and costfactors. In addition, the quality of products will improve with theability to produce more prototypes in actual forms at lower prototypingcosts.

Advantages also exist for manufacturing in such environments. Inpractice, the cleanspace fabricator environment may be a small toolbased environment that occupies the same cleanspace as the otherprocessing types. Alternatively, a large tool semiconductor cleanspacefabricator may be attached to other cleanspace fabricators for the otherprocessing and the assembly processes. Advantages will increase as thecomplexity of components integrated into products increases.

3DIC Techniques in Cleanspace Fabricators

Proceeding to FIG. 8, a depiction of an exemplary processing flow forThree Dimensional Integrated Circuits (3DIC) is shown. A related fieldof Three-Dimensional Chip Packaging will be enabled in much the samemanner for a cleanspace fabricator environment. At 810, a cross sectionof a semiconductor wafer for a region of a portion of an integratedcircuit is depicted. A thin region on the substrate contains andsupports the integrated circuit, while a bulk of the substrate isrelatively unrelated to the function of the integrated circuit. Atypical process, at 820, may result from thinning the substrate, atleast in regions of the wafer. At 830 various features related to 3DICor 3D packaging may be formed including through silicon vias and solderball features. The results at 830 in various forms may then be stackedeither upon each other or upon packaging structures to exploit threedimensional spaces at 840. In some embodiments, substrates withstructures such as through silicon vias may be formed, either with orwithout associated circuitry.

In the inset of 850, a schematic relationship of the various aspects of3DIC or 3D packaging may be observed. In the depiction a substrate, 855with circuitry upon it at 856 may have through silicon vias processingat 854. The vias may make an electrical connection from the front of thesubstrate where the circuitry is to the back of the substrate. At theback of the substrate interconnection features such as the solder ballsdepicted at 853 and 857 may connect a next circuit on a substrate at 851through the metal layers of the circuit at 852.

The various processing steps, related to 3DIC and 3D packaging, areeasily incorporated into cleanspace fabricator type structures.Substrate or Silicon reactive ion etching to create through silicon viasas well as the thinning operations on substrates, the processing tocreate interconnection elements such as solder balls and the like areconsistent with a cleanspace environment where a cleanliness level ofthe environment is positive to the quality of the result.

The cleanspace environment based fabricators may create a newinfrastructure that enables cost effective operation at small substratesize. The use of small substrates for the IC processing also createsadditional advantages for the 3DIC and 3D Packaging processes. A smallsubstrate may be made much thinner in its initial form; for example, atwo-inch substrate may start at 280 microns of thickness while aneighteen-inch substrate may start at 925 microns of thickness. In some3DIC and 3D Packaging processes portions of a wafer will be thinnedleaving edge rings or internal ridges to support the wafer while beingprocessed for the 3D related needs. A smaller substrate may start outthin enough, or be fully thinned across its body, or have a much thinnerportion of the substrate after a thinning process. In addition, angularerrors in the alignment of the front of substrates to the back ofsubstrates result in far smaller errors in distance terms the smallerthe radius of processing is from the center of the wafer. All of theseaspects may improve processing costs, times and quality as well asenabling more processing flexibility for novel processing.

Additive Manufacturing in Cleanspace Fabricators

Additive Manufacturing may represent a class of fabrication techniquesthat place material into or upon manufactured items to realize threedimensional forms that are represented in a digital format. An exampleof such a technique may be three-dimensional printing where droplets ofmaterial are placed upon a substrate in a similar fashion that ink isplaced upon a paper as either the paper passes under a printingcomponent or the printing component moves above the paper. Anotheradditive technique may be stereolithography, where a substrate isimmersed in a liquid of reactive material and lowered layer by layer asa laser pattern writing source hardens reactive mixture in selectregions of each layer. There are similar powder based additivemanufacturing formats as well just to name some examples. Variousmaterials may be shaped in these manners including metals, insulators,gels and the like. Composite materials may also be formed that may mixthese materials or incorporate other materials in a matrix that isgrown—such as the forming of three dimensional lattices of cellularmaterial.

Additive Manufacturing techniques are well fitted in a cleanspacefabrication environment. The ability to prototype shapes based upondigital models allows for complex products that include semiconductorcomponents to be rapidly formed. In the previous example of Touch screenbased processing for example encapsulating material may be processed byadditive manufacturing techniques. In some of the examples metalfeatures may be formed within the manufactured form for various reasons.The ability to process substrates in a cleanspace environment may allowfor chips to be incorporated into product forms where the chip is neverdiscretely packaged, an entire layer of the product may be encapsulatedat a time. This may allow for smaller form factors with lower cost orimproved technical aspects like strength and thermal dissipativeaspects.

The use of raw die attached directly to a substrate formed upon anactive Touch screen display substrate may allow for the integratedcircuits to be tested as the assembly processing occurs. Since thetesting may occur before any encapsulation of the semiconductor diceoccurs and before the multilayer distribution levels are encapsulated,defective conditions found during the test may be remedied with variouskinds of rework or use of redundant die attachment strategies.

As mentioned, manufacturing may be effectively carried out in thecleanspace environments. However, prototyping may be particularlyeffective in a fabricator environment with multiple types of fabricationas discussed. Changes to die design, changes to multilayer routingschemes, addition or removal of components or interface elements likeswitches or connectors can all be flexibly adopted into the digitalmodels for the encapsulating and packaging/case designs for the finishedproducts that can be manufactured using the additive designcapabilities. The small tool cleanspace fabricator designs may haveadditional advantages since specialized processing tools or processingtools with engineering changes to support a prototype need areeffectively supported in the environment of small reversibly replaceabletools that interface with tool chassis formats.

Proceeding to FIG. 9, some aspects of additive design that may becarried out in the cleanspace fabricator designs may be found. Utilizingthe exemplary Touchscreen type substrate as a base for examples, at 910an additive manufacturing processing tool which may be located withinmultilevel cleanspace fabricator which has automation capable ofhandling the Touchscreen substrate may be depicted. The Touchscreensubstrate may have been moved from one processing tool to this additivemanufacturing tool by the automation tooling in FIG. 5 at 530 forexample. In the example, the touch screen substrate may have had itsfinal layer of metal interconnections deposited and then integratedcircuits bonded in the prior operations. In the additive manufacturingtool, an encapsulating and sealing layer may be printed upon thesubstrate in select areas that have been digitally modeled to beappropriate for the substrate design and the needs to add components toit at subsequent steps. The result of the processing may be seen in theexample of item 920 where a planarized film layer indicated in the solidblack pattern with interruptions at bonding locations may be formed.

Continuing the example at 930 a set of energization elements may beadded to the substrate. Item 931 may represent a battery component whileitem 932 may represent a fuel cell component being attached to the touchscreen substrate. The substrate with attached energization elements maybe moved by automation into an additive manufacturing tool at 940 wherean encapsulation layer may be deposited across the entire deviceresulting in the coated piece shown within the additive manufacturingtool at 950. At 950, another additive manufacturing step may beperformed to build the structural case around the encapsulatedcomponents. In some embodiments, metal casing may be formed by theadditive manufacturing processes. In other embodiments, the additivemanufacturing process may add plastic or polymeric materials to definethe casing of the device. In still further embodiments, the additivemanufacturing tool may add adhesives to the substrate in digitallymodeled locations and a case plate may subsequently be placed upon thesubstrate. At 960 an exemplary finished piece may be found.

Fuel Cells in Cleanspace Fabricators

There may be numerous types of substrates and devices consistent withproduction in a cleanspace fabricator environment including micro scalemachines, biological or standard fluidic processing cells and the like.An application of note related to the examples demonstrated herein mayrelated to the design, development, prototyping and manufacturing offuel cell components. There are designs of Fuel cell technology thathave been around for decades; however, the construction of small fuelcell technology has many novel aspects to it and micro-scale elementsmay have particular sensitivity to particulate and other types ofcontamination. Construction of prototype fuel cells and production ofnovel small fuel cell designs fit well within the scope of manufacturingactivities that benefit from the novel cleanspace fabricatingenvironment.

The control and miniaturization ability of semiconductor processingtooling may offer advanced processing capabilities that may allow formore intricate and smaller scale features to be formed into fuel celldesigns. In addition, as mentioned in prior sections, the flexibility ofthe cleanspace fabricator environment may allow for the fuel celldesigns to be constructed upon device substrates of various typesallowing for novel design aspects.

In addition, the structures that may contain the fuel for small fuelcells may also be designed, prototyped and manufactured in cleanspacefabricator environments. There may be novel methods of defining poresand membranes into the structure built upon the touch screen substrate.These structures may allow for the filling of chemical into a storageregion of the fuel cell. The membrane structures may either allowethanol and water to pass through, or be stored while filtering out ornot absorbing other chemicals for example. There may be numerous meansto fill a reservoir for a fuel cell. The encapsulating aspects of theadditive processing on substrates processed in clean space environmentsmay allow for novel structures to be formed which nonetheless areisolated from electronic components in the rest of the device.

Product Advantages of Cleanspace Fabrication for Prototyping andManufacturing

To summarize, the cleanspace fabricator environment along withreversibly removable tools, particularly when the substrates to beprocessed are small creates a prototyping environment with high speedprototyping capabilities. This is with respect to the processing ofsubstrates in the environment, but also relates to the creation ofspecialized tools or engineering changes to existing tool designs tosupport new processes, new materials or other novel requirements to makenew types or designs of products.

The flexibility advantages may also relate to manufacturing of products.In some embodiments, tailored products or products with user selectableaspects may be manufactured with ease in cleanspace manufacturingenvironments with large numbers of processing tools based on theprocessing of smaller substrates. Customized product definitions mayallow for customized security aspects as well for example. Theenvironment may also result in lower part costs due to the loweredrequirements on support personnel and the higher numbers of processingtools that may be required when smaller substrates are processed, whichmay result from economies of scale based on higher numbers of tools aswell as advantages that standardization of parts in the small toolchassis models may afford. The fabrication of numerous types of productsin the environment may be enabled. As demonstrated for example, Touchscreen type products may in some embodiments be produced in large scalewhere the same environment is used to make the integrated circuits, theinterconnection schemes, the touchscreen components, and theenergization elements that comprise electronic devices with touchscreens.

Two Sided Smart Phones, Smart Devices and Touchscreen Devices

Referring to FIG. 10A through 10F, a form of unique smart device thatmay be fabricated according to the methods and apparatus of the presentdisclosure is illustrated. At FIG. 10A, the front of a standard smartphone device 1000 is illustrated. The smart phone may have a small frontfacing camera 1003, a speaker 1002, a touch screen 1001 and activationbuttons 1002. Referring to FIG. 10B, a unique second side screen 1010 ofthe smart phone device 1000 is illustrated. The second side screen 1011may also have a typical rearward facing camera 1012 with a flash 1016.There may also be a speaker and microphone configured on both sides ofthe device. There may be numerous activation buttons 1013, 1014 and 1015that may have numerous functions. Referring to FIG. 10C, the left side1020 of the two-sided smart phone device is illustrated with exemplarybuttons, switches, connectors and other such devices. For example, aringer switch 1021 and volume buttons; up button 1022 and down button1023 are shown with reference numbers. In FIG. 10D, an exemplary rightside 1030 is illustrated. There may be various connectors, switches,buttons and the like that may be present but not enumerated, but anexemplary port 1031 for a memory device is depicted. Referring to FIG.10E the top 1040 of the two-sided smart device is illustrated with twoactivation buttons 1041 and 1042. Referring to FIG. 10F the bottom 1050of the two-sided smart device is illustrated with an earphone jack 1051,with a cable connector port 1052 and speakers 1053 as examples.

A two-sided smart phone, may refer to the fact that the front and thebackside of the device may have functional screens such as touch screensthat can display and sense touch based signals. There may be manydifferent uses and functions of a second side touchscreen on a smartphone or another type of smart device. In the following figures, anumber of examples are depicted.

Referring to FIGS. 11A and 11B, a set of exemplary functions which areactivated and controlled by electronics connected to the second sidetouch screen are illustrated. The illustrated functions include anexternal switching control of the antenna 1110, an external switchingcontrol of the camera 1120, and an external switching control of themicrophone 1130 as examples. There may be users, companies ororganizations who want to have specific control over their smart deviceantenna, camera and sound sensing equipment for security and otherreasons. Since in some examples an external party may have the abilityto “hack” a smart phone or smart device with a wireless based attack andturn on the devices cameras or microphones or antennas even if the phoneis set by software to have those devices off. The illustrated functionmay allow for a redundant and external means to switch the devices onand off. In some examples, as seen in referring to FIG. 11B the functionmay be activated by touching 1140 a touch screen displaying theparticular function. In other examples the phone switches 1013, 1014 and1015 may be used to control the state, whereas the display just displaysthe status of the device. There may be more sophisticated function thatis activated relating to the components illustrated, such as for examplemonitoring modes that may indicate the software intended state of thedevice versus the physical state, or measurements about the amount ofdata that is passed by the devices or other such functions beingdisplayed on a second side screen.

Referring to FIGS. 11C and 11D, some additional supplementary functionsof a two-sided smart phone may be illustrated. At FIG. 11C, the secondside screen 1010 of the phone may include functions such as externalencryption functions 1150 and WIFI phone functions 1160. These functionsmay be activated by touching the screen 1170 or in other examples,buttons on the phone 1013-1015. In some examples, when a user isconcerned about security on his phone encryption protocols may beactivated with external encryption functions 1150. The encryption mayfunction for example, by encrypting and decrypting data transmissionwhich may be data transmitted over cellular services where the cellularservice encrypts the data before transmission, or in other examples aservice may encrypt data before it is passed over the cellularcommunication systems. Such a capability may allow for more protecteduser privacy while enabling such functions as GPS or other protocols,where a user may encrypt his identity in a manner that only selectedservices are able to decrypt. There may be a supplemental port on thephone that interfaces with integrated circuitry specifically for thisfunctionality that allows for an external “token” or device containingdecryption information. Alternatively, the function may be enabled bywireless pairing to user dedicated devices that contain encryptionprotocols, such as a smart watch, smart ring or other separate device.

Another type of encryption may be activated to deal with data stored onthe smart device. An encryption device may intercept data transmissionfrom storage devices such as flash memory and other parts of a smartdevice and encrypt and decrypt the data during its function. In suchexamples, the user may activate the encryption function to “lock thedata” in the storage devices.

WIFI based communications may allow for conversation and other datatransfer. The second side of the smart device may access supplementarycircuitry that may allow for the simultaneous using of a cell phonefunction on one side and a WIFI based phone on a second side.

Referring now to FIG. 12, another function of a second side of atwo-sided smart phone may be to activate a much better performing“selfie” 1210 type picture taking. The rear facing phone in a smartphone is typically the much better performing camera device. A user mayuse this camera while simultaneously viewing the image on the secondside screen to allow for a functional selfie. In some other examples, abetter image may be passed onto a two-way video conference function byusing the superior rear camera and displaying the other signal on thesecond side screen.

Referring now to FIGS. 13A and 13B, another function of the second sideof a two-sided phone may be to coordinate operations of a DECT or WIFIfunction. This may be similar to the WIFI function as described earlier,but in some examples the second side may coordinate the ability to havea conversation with the phone using a DECT base unit 1360. Therefore, auser may have one side of their smart phone connected and displayinginformation from a typical cellular phone with WIFI communicationscapability while simultaneously having the ability to interface with aDECT service or with a WIFI base for voice communications. Thus, a usermay have their cell phone functioning in general, but when they are athome or work, their second side may provide a differently routedcommunication channel that is enable by added circuitry placed into thesmart phone so that it interfaces with the second side touch screen. AWIFI functionality may also include the ability of the phone to act as a“hot spot” rebroadcasting connectivity to other WIFI enabled devices. Insome examples, the cellular enabled capability of the first phone sidemay provide connectivity while a function of the backside may enableWIFI connectivity in a “hot spot” mode.

Referring to FIG. 14A and FIG. 14B, a two-sided smart phone may allow asingle smart phone device to display and interact with two separate cellservices. For example, the first side may interface with a first cellservice 1400 and the second side with a second cell service 1410. Thereare numerous users that have two smart phones that they carry aroundwith them, one for “work” and the other for “personal” communicationsand data. In this example, the user could carry a single smart phonedevice where each of the two sides could interface to a differentcellular service.

Referring to FIG. 15A and FIG. 15B another function of a two-sided smartphone may be illustrated where the second sided of the phone may be amirror image 1510 of the first “main” screen. There may be numerousutility to having such a mirror function. In some examples, the smartdevice may be held between two users who may simultaneously view thesame information may standing facing each other. In some other examples,a phone left down on a surface may always have a surface that may be onfacing up, or may be activated with a touch.

Referring to FIGS. 16A and 16B another use of a two-sided phone isillustrated. In some examples, a user may want to have a standard smartphones functions on the first side of the phone interfaced and displayedon the main screen 1400. However, the user may also wish to selectcustomized functions of various kinds for his smart phone which mayinterface with the second side. In all these examples, but particularlyin this example, a standard commercially available smart phone may beretrofitted to add a second side with additional control electronics anddevices for the customized functions. In some examples, there may be asecond screen 1600, with some or all the functions that have beendescribed herein previously. What the user may also specify areadditional sensor functions that he wishes his phone to perform such asthe first sensor 1650 and the second sensor 1660. The sensors, may sensenumerous conditions. In some examples, the sensors may be more sensitivesensors that exist in standard phones like gyroscopes, light sensors,force sensors, radar and proximity sensors, sound sensors,accelerometers or there may be other sensing functions like temperature,pressure, wind speed, magnetic field and the like as non-limitingexamples. The sensors may include more advanced cameras that may besensitive at other spectral regimes or have supplementary capabilitiesto the rear facing camera 1012 or may have advanced functions such asLidar. There may be chemical and biological sensors of various kinds aswell for example. In some examples, carbon dioxide, carbon monoxide,propane, methane, oxygen, ozone, allergens of various types and othertypes of safety sensors may be incorporated. Some safety functions mayinclude smoke sensing, radioactivity and radiation sensing and the like.Sensors may be used for automatic sensing of various kinds where thesmart phone may collect the sensing information as part of itscustomized function and use the commercial smart phone backbone forvarious communication and processing.

There may be various touch sensing devices such as a first “touchlet”1630 or a second touchlet 1640 which may be small displays with adifferent type of touch sensing that may be enhanced in various wayssuch as pressure sensitive function and the like.

In some examples, there may be various additional functions that arecustomized by the user. These may vary across a wide range of functions,such as enhanced display capability such as holographic display forexample. There may be stereoscopic camera capabilities. There may beenhanced energy transfer functions that tie into batteries of thedevice. There may be other enhancements such as fuel cell incorporation.There may be numerous types of exemplary functions as illustrated by afirst function 1610 and a second function 1620. The point is that a usercan specify customized functions that may be developed by third partiesfor example and can be added to a customized phone device for a user.

Customized Production of Smart Devices, Phones and Touchscreen Devices.

The ability to develop and manufacture customized smart devices, phonesand touchscreen devices is well supported by the cleanspace fabricatorconcept as has been described. Referring now to FIG. 17, an example of acleanspace fabricator 1710 is illustrated where the fabricator may belocated in a storefront 1700 based location. In some examples, thestorefront may be located in an urban environment, where users ofsmartphones may enter the storefront and configure their customizedsmart phone or other smart device. In other examples, the smart devicesor touch screen devices may be customized for various industrial,experimental or personal type uses. A cleanspace allow for a facilitywhich does not demand a lot of space or utilities from a location suchas electricity, heating, and air flow while providing a cleanspace forthe making of sensors, circuits and for placing and connectingintegrated circuits and other components. The result may be customizedsmart devices and customized touchscreen devices 1720.Smart Devices, Phones and Touchscreen Devices with Hardware Encryption.

A smart device, phone or touchscreen device may be assembled or alteredusing a small form cleanspace fabricator with custom security featuresthat can be made unique to the device or a collection of devices. Ahardware based encryption device may be formed into a pair of devices toinclude enough stored data, made common between the devices to create atime changing encryption protocol. In an example, a new character may beadded to an encryption code at a selected period such as every hour, orat a variable but programmed frequency common between the paired device.In some examples, a portion of the encryption coding may come fromphysical measurements of parameters such as a capacitance reading thatcomes from a device formed in encapsulation layers manufactured into thepair of devices in the cleanspace fabricator environment. For example, arandom pattern of numerous electrode pads may be formed as encapsulatinglayers along with dielectric layers, which may be very difficult tomaintain if the encapsulating layers are removed. Thus, a secureencryption code may be engaged in hardware based schemes which may noteasily be detected or broken. If for example all the circuits of thephone, smart device, or other device are encapsulated with multiplelayers that are precisely controlled so that a particular dielectricthickness is found at capacitors, which may be in examples be millionsof devices across the encapsulating layer where only a small subset areused for the security protocol in the paired devices. In some examples,other physical measurements such as resistance, optical dielectriccharacters or other physical characteristics that may be formed bycreating encapsulating layers. A person intent on breaking the code byphysically delayering the device may not be able to get to the devicewithout deactivating the physical measurement aspect.

In a secure cleanspace fabricator, pairs of devices or collection ofdevices may be made to have the same physical characteristics—to a knowndegree of variation for the collection of devices. Thus, encoded datamay be securely written to the collection of devices to be stored in amemory device with a physical supplement to the encoding. The devicecould use the physical measurement for various purposes. The measurementmay control timing of dynamic change of an encryption key as an example,or it may provide data values to be included in the encryption key. Thephysical device that may be assembled as part of the encapsulation of ahardware encryption device may also have security protocols. Forexample, any change in the physical measurement detected may be used tostart a protocol to disable the device and perhaps initiate aself-destruction protocol which may range from the erasure of the storeddata to physical destruction from electrical means or to chemical meanssuch as initiation of a reaction of a foil of reactive metals which maycreate enough heat to melt portions of electrical devices to renderinvestigation of stored data remnants difficult. In some examples, theself-destruction process may result in physical damage to the device. Achange in a physical measurement may most likely be something thathappens when a third party is trying to access the encryption chip. Inother cases, it could come from the device being lost or damaged in use,where a disabling of the device is warranted for security purposes. Thecreation of customized devices with physical measurement as well asincorporation of materials and structures for self-destruction may begreatly enhanced using a cleanspace fabricator operating without humanoperators.

A hardware based encryption scheme as discussed may provide securitythat may have advantages such as not using an external processor toperform processing related to encryption. This may result in higherspeed as well as more security to the scheme. Referring to FIG. 18, anexemplary device to be produced may include a smart phone 1801. In someexamples, a user may have a pair of smart phones created where anysecure data sent between the phones may be securely encrypted in acustomized way just between the pair of smart phones. Thus, a pair ofcustomized encryption chips 1811 and 1812 may be placed into a pair ofsmart phones 1801 and 1802. These phones may be the only devices thatcan encrypt and decrypt data in real time, and may include a dynamicencryption key synchronized to internal, with ultraprecisemicroelectronic clocks, or external clock signals.

In other examples, a smart phone 1801 and a network pluggable device1822 pair may be created where the network pluggable device may beplaced in a secure network to share encrypted data. The networkpluggable device may be fabricated in a very similar fashion to thesecond smart phone 1802 but may be made to plug into a server forexample. Thus, if the server is kept in a secured location, the securityof the communication is ensured by the encryption protocol between thesmart phone 1801 and the network pluggable device 1822.

In some other examples a collection 1801, 1832A, 1832B, 1832C, 1832D and1832E as a non-limiting example of more than two commonly encrypteddevices may be created where the devices can share an identicalencryption scheme. In the example, 6 encryption devices 1811-1816 may beassembled into smart phones 1801, 1832A, 1832B and 1832C as well asnetwork pluggable devices 1832D and 1832E.

As mentioned earlier, devices may be formed with the ability toself-destruct in the event of tampering or breaking. The creation ofsuch devices may involve steps that are dangerous for human operators ofthe assembly equipment. The cleanspace fabricator concept allows formanufacturing and assembly in facilities that do not require humanoperators of the equipment. An example of a self-destruction cycle thatmay maintain safety to an operator may include a placement of a metallicfoil device made of thin alternative layers of reactive metal foils thatare stable until activated such as by an electrical current. When thefoils react, they may release a discrete amount of energy in a veryrapid amount of time. The rapidity of the release may cause thetemperature in the near region of the foil to rise to extremetemperatures such as over 400 degrees Celsius or more. This may causeintegrated circuit metallurgy to melt, or may at least cause memoryelements such as flash memory devices to erase any evidence of the datastate they were last holding. Without stored data, the encryption devicewould not be able to function, and a third party trying to gain accessto the prior encryption keys that were used for communication would nothave a functional means to recreate the keys.

It may be possible conceptually for a third party to defeat theself-destruction protocol with sophisticated tactics, therefore, anotherfunction that assembly in a cleanspace fabricator could enable is thesecure inclusion of physically measurable aspects into the encapsulationof the encryption chip type devices. Thus, for a third part to gainaccess to the encryption chip, they may need to remove the encapsulationlayers. The design of the physical measurable devices may mean thatcritical information relevant to the deciphering the encryption keys maybe destroyed as part of gaining access to the encryption chip.

Referring to FIG. 19 a non-limiting example of a physical measurement isillustrated. The illustrated example includes a resistive network or aresistor network that may be measured by the encryption chip or circuitfor the physical measurement supplement to the encryption key. Howeverother measurable quantities such as capacitance, optical transmittance,and the like may be used to create a physically measurable quantity thatmay be incorporated into an encryption protocol. An internal surface ofan exemplary smart device 1901 and an encryption chip 1910 may beassembled, for example in a cleanspace fabricator, into the assembledcombination device 1920. The assembled combination device may beencapsulated with a complex set of encapsulation layers that includeencoded physical measurement aspects 1930. In the inset 1940 which is ablown-up example, an array of metallic squares is illustrated. Thesquares may have numerous connection paths into the encryption chip1910. These metallic squares be organized into subsets such as rows orcolumns or may have relatively random orientations of connection whichmay all be defined by an under layer (not illustrated) to the connectionpads. A data pad 1941 and a ground connection pad 1942 are illustrated.

The connection pads may receive, in a non-limiting example, a film ofcasted graphene ink which has been formed into a foil 1951. The castedgraphene ink may be treated with heat cycles and the like in a remotestep and may have pads of metal deposited upon the sheet for electricalcontact. The pads of deposited metal may also be coated with pieces offoil comprised of multiple extremely thin layers of reactive metals anda solder coat. When the pads of deposited metal and the casted grapheneink foil are placed upon the encryption chip, an activation of thesolder connections may be caused to occur with a standard protocolincluding either electrical, thermal, or sonic activation to join themto the underlying pads such as data pad 1941.

As illustrated in the inset 1950, the graphene foil may be attached andexposed during encapsulation of the device. The graphene foil may beprocessed such that it has a very high sheet resistance in the absenceof a laser annealing treatment. Thus, irradiation 1954 may beselectively made incident upon regions of the graphene sheet asillustrated by the circular irradiation site 1953 over one padconnection. As well as which regions above connection pads areirradiated the process may control other parameters accurately such asthe dimension of the irradiation site 1953. In the example, theirradiated sites such as irradiation site 1953 will create a variableand definable resistance path through the connection pad. In someexamples, the resistance may be dynamically measured while the encodingis being performed and the laser processing may be tailored to give aselect value. It may be obvious that the laser treatment of the graphenefoil may not create a physical distortion of the film that may beobserved on a macroscale, thus it may be invisible to a third party. Ina subsequent step as shown in inset 1960, a metallic film 1961 may bedeposited over the encapsulation region. The metallic film 1961 may bethick enough to obscure the presence of the contact pads thereunder andmay be deposited at multiple angles to obscure relief patterns. Thegraphene film may be sensitive to thermal effects and therefore a cooleddeposition process may be used. There may be numerous other layers suchas an insulating top layer, such as of Parylene, that may be depositedupon the encapsulation to seal all the layers thereunder. Various dyesor other colorants may be added to the top layers to obscure the natureof underlying layers for added security. These steps may be performed ina customized manner in various fabrication environments but which may beeven more functional in a cleanspace manufacturing environment.Customized production may result in secure, unique encrypted pairs orcombinations which may be used for voice communications, videocommunications or other data communications between trusted parties.

There may be numerous models related to the types of devices into whicha hardware encryption device with the various physical measurementsupplementary protections may be added. As mentioned smart phones, smartdevices, tablets and network pluggable devices may be included. Thenetwork pluggable device may be plugged into servers or other workstations, and in some models, may be a pair that includes one node at atelecommunications provider and the other in a smart device. Otherelectronic circuit boards related to data communication including motherboards of desktop computers, mainframes, telecommunications systems,modems, routers, WIFI routers may have hardware encryption devices whichvary encryption over time with physical measurement supplements tocreate a unique pairing amongst two or more customized devices. Hereto,the physical measurements may be used for numerous encryption functionsincluding determining the order of stored encryption keys to be used, assupplementary portions of the encryption key data and/or as input to thedetermination of timing cycle for the changing of encryption keys.

While the invention has been described in conjunction with specificembodiments, it is evident that many alternatives, modifications andvariations will be apparent to those skilled in the art in light of theforegoing description. Accordingly, this description is intended toembrace all such alternatives, modifications and variations as fallwithin its spirit and scope.

What is claimed is:
 1. A method of protecting a data communication of asmart device, the method comprising: assembling a unique integratedcircuit into a smart device, the unique integrated circuit comprising:at least a portion of a unique encryption key is physically encoded intohardware of the unique integrated circuit during assembly of the uniqueintegrated circuit, and a processor of the unique integrated circuitoperational to perform encryption processing upon data communicated intoand out of the smart device routed through the unique integratedcircuit; and configuring the smart device to pass communications throughthe unique integrated circuit to be encrypted before transmission of thedata.
 2. The method of claim 1 wherein the physical encoding involvesprocessing a film to alter its resistance, wherein the resistanceencodes a data value.
 3. The method of claim 2 wherein the filmcomprises graphene.
 4. The method of claim 1 wherein a uniqueness of theunique integrated circuit includes a presence of the encryption keysencoded into hardware of the integrated circuit.
 5. The method of claim1 additionally comprising: manufacturing the unique integrated circuitin a cleanspace fabricator, wherein the cleanspace fabricator comprisesa vertically deployed primary cleanspace contained within the cleanspacefabricator, wherein processing tools are vertically deployed, andwherein processing tools are accessible from a periphery of thecleanspace fabricator.
 6. The method of claim 5 additionally comprising:configuring the cleanspace fabricator at a point of sale of smartdevices, wherein the smart device may be uniquely produced for a user ata point of sale.
 7. The method of claim 5 additionally comprising:producing multiple copies of smart devices comprising unique integratedcircuits wherein at least a portion of the physically encoded encryptionkeys of the multiple copies are matched to allow end to end encryptionthrough the unique integrated circuits.
 8. The method of claim 5 furthercomprising: producing at least a pair of devices comprising the uniqueintegrated circuit wherein at least a portion of the physically encodedencryption keys of the multiple copies are matched; wherein one of theat least a pair of devices is the smart device; and wherein one of theat least a pair of devices is a network pluggable device.
 9. The methodof claim 8 further comprising: installing the network pluggable deviceinto a server.
 10. The method of claim 9 further comprising: routing adata communication between the smart device and the server throughintermediate communication links, wherein the data communication isencrypted between the unique integrated circuit of the smart device andthe unique integrated circuit of the network pluggable device.
 11. Themethod of claim 10 further comprising: sending a signal to one or bothof the unique integrated circuits of the smart device and the uniqueintegrated circuits of the network pluggable device wherein the signalinitiates a self-destruction, wherein the self-destruction alters thephysically encoded encryption keys.
 12. The method of claim 10 whereinat least a portion of the data from the data communication is stored inmemory in its encrypted form.
 13. A method of protecting a datacommunication of a smart device, the method comprising: assembling aunique integrated circuit into a smart device, the unique integratedcircuit comprising: at least a portion of a unique encryption key isphysically encoded into hardware of the unique integrated circuit duringmanufacture of the integrated circuit, a processor of the uniqueintegrated circuit operational to perform encryption processing upondata communicated into and out of the smart device routed through theunique integrated circuit; and configuring the smart device to passcommunications through the unique integrated circuit to be decryptedduring a receipt of the data.
 14. The method of claim 13 wherein aphysical encoding involves processing a film to alter its resistance,wherein the resistance encodes a data value.
 15. The method of claim 14wherein the film comprises graphene.
 16. The method of claim 13 whereina uniqueness of the unique integrated circuit includes a presence of theencryption keys encoded into hardware of the integrated circuit.
 17. Themethod of claim 13 additionally comprising: manufacturing the uniqueintegrated circuit in a cleanspace fabricator, wherein the cleanspacefabricator comprises a vertically deployed primary cleanspace containedwithin the cleanspace fabricator, wherein processing tools arevertically deployed, and wherein processing tools are accessible from aperiphery of the cleanspace fabricator.
 18. The method of claim 17additionally comprising: configuring the cleanspace fabricator at apoint of sale of smart devices, wherein the smart device may be uniquelyproduced for a user at a point of sale.
 19. The method of claim 17additionally comprising: producing multiple copies of smart devicescomprising unique integrated circuits wherein at least a portion of thephysically encoded encryption keys of the multiple copies are matched toallow end to end encryption through the unique integrated circuits. 20.The method of claim 17 further comprising: producing at least a pair ofdevices comprising unique integrated circuits wherein at least a portionof the physically encoded encryption keys of the multiple copies arematched; wherein one of the at least a pair of devices is the smartdevice; and wherein one of the at least a pair of devices is a networkpluggable device.